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Continuous rim diamond cutoff (wafering) blades are recommended for aggresive general laboratory sectioning of ductile materials, most metals, polymers, pc boards, thermal spray coatings and titanium.

Priced per each.

Cut Off Wheel Size

3" x .006" x 1/2", 4" x .012" x 1/2", 5" x .014" x 1/2", 6" x .020" x 1/2", 7" x .025" x 1/2"


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