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Continuous rim diamond cutoff (wafering) blades are recommended for aggresive general laboratory sectioning of ductile materials, most metals, polymers, pc boards, thermal spray coatings and titanium.
Priced per each.
| Weight | N/A |
|---|---|
| Cut Off Wheel Size | 3" x .006" x 1/2", 4" x .012" x 1/2", 5" x .014" x 1/2", 6" x .020" x 1/2", 7" x .025" x 1/2" |
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